Infineon and Mitsubishi Electric to Co-Supply Industrial Drive Components

Infineon and Mitsubishi Electric are to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages, SmartPACKs and SmartPIMs. This package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two companies.

Under the agreement, Mitsubishi Electric will market its latest generation power chips of various ratings (current range: 15 A up to 150 A, voltage class: 600 V and 1200 V) in the Smart-1,-2 and -3 housings of Infineon. As the creator of the new SmartPACK/PIM module concept, Infineon will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing.