Digi Launches XBee and XBee-PRO ZigBee Modules

Digi International introduced a another line of XBee and XBee-PRO ZB embedded ZigBee modules based on the Ember EM357 System on Chip (SoC). The new modules add Surface Mount Technology (SMT) and Serial Peripheral Interface (SPI) to the product family. The SMT modules are suited for high-volume applications in the energy and controls markets where manufacturing efficiencies are critical. The addition of Serial Peripheral Interface (SPI) provides high-speed throughput and optimizes integration with embedded micro controllers lowering costs of development and shortening time to market.

“The enhanced technology will be the standard for all future XBee releases,” said Larry Kraft, senior vice president of global sales and marketing, Digi International. “Integrated into a vast number of devices throughout the world, the XBee product line improvements make the modules an even better choice for Smart Energy and other ZigBee networking applications. We’re also introducing a more aggressive pricing structure as a result of improved product design and lower manufacturing costs.”

“Ember is the industry’s leading provider of ZigBee networking systems including chips, stack and tools and Digi is a strong partner developing wireless networking solutions,” said Dennis Natale, Ember vice president of sales. “Built on our EM357 ZigBee SoC and EmberZNet PRO stack, Digi’s XBees make it easier, faster and more cost effective to develop many ZigBee Smart Energy solutions and other ZigBee enabled devices.”

The new modules with SMT will be backwards compatible with existing hardware and software. When coupled with a ConnectPort X gateway, Digi says customers can also use the iDigi Platform to integrate XBee ZigBee endpoints into their systems.