Cinterion Launches Thin HSPA+ Module for Machine-to-Machine Applications

Cinterion has launched the world’s thinnest HSPA+ M2M module. This fully ruggedized, high-bandwidth module features flexible Surface Mounting Technology and enables secure, high-speed voice and data communications on global 2G and 3G cellular networks. It also provides a reliable bridge to forthcoming 4G LTE networks. At just 2 mm in height, PHS8 is useful for the most space-constrained M2M solutions.

“Our new PHS8 module enables advanced communications for today’s networks and readiness for tomorrow’s technology,” said Norbert Muhrer, CEO, Cinterion. “Providing a compatible footprint as a bridge to the future while protecting M2M solution longevity is key to implementation success. For our customers, this implies optimizing their technology investments for many years to come.’

The module’s thermal design extends the temperature range from -40 deg C to +85 deg C for reliable communications in even the most extreme conditions. Integrated voice coding algorithms enable superior voice quality and hands-free capabilities essential for industrial PDAs and mobile communications even while in transit or at work in the field. PHS8 developer kits are available immediately with mass production expected in Q1 2012.