Beckhoff to Showcase EtherCAT and PC Control at Trade Shows

At K 2010, the international trade show for plastic and rubber which will take place between 27 October and 3 November in Düsseldorf, Beckhoff will demonstrate its PC- and EtherCAT-based control solutions for plastic machines and introduce a new turnkey solution for injection moulding machines. Beckhoff is also exhibiting its PC- and EtherCAT-based control solutions for metal forming at EuroBlech 2010, which takes place from 26 to 30 October in Hanover, Germany..

The "TwinCAT Injection Molding PLC Framework" from Beckhoff is the basis for the turnkey solution for injection moulding machines. Technology modules such as the controller for injection and holding pressure offer optimum solutions for the injection moulding process. The open, PC-based architecture of the Beckhoff control system enables the machine manufacturer to use in-house expertise or ready-made software components from Beckhoff. Beckhoff also developed a new compact and cost-effective control solution for blow moulding machines based on Intel Atom processors. It consists of a 6.5-inch Panel PC and a technology software for blow moulding machines, including visualisation.

For PC-based control of metal forming, Beckhoff intends to showcase its broad range of scalable Industrial PCs, I/O systems for all common fieldbuses, TwinCAT automation software for PLC and Motion Control, servo drive equipment, the TwinSAFE integrated safety solution and EtherCAT, the fast real-time Ethernet bus system.

In TwinCAT 3, Beckhoff presents the new software generation for PC-based control technology. In addition to the object-oriented IEC 61131-3 extensions, the languages are available in C and C++. The integration of Matlab/Simulink enables the application in scientific fields. The runtime runs under harsh real-time conditions with the use of multi-core technology and the support of 32- or 64-bit operating systems.

In addition to industry solutions, trade visitors to the Beckhoff booths will find numerous new items: from the Industrial PC and Embedded PC families equipped with the latest processor technology to the HD Bus Terminals, which continue the trend towards compact designs with high packing density..